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Fluxes

 

 
No Clean
Rosin Base
Water Soluble

 
NP manufactures and supplies wide range of Fluxes for use in electronic, automotive, electrical and other industries. The range of Fluxes are tabulated below. Our technologists are available to interact and develop any other formulations to meet clients’ specific requirement.
LIQUID SOLDERING FLUXES
Product Designation Technology Colour Specific Gravity Nominal Solid Content Recommended Application
Alcohol based
NP 207 Rosin - Containing Clear amber 0.805 6 – 8% Flux can be applied on component or printed circuit boards by dipping, brushing or spraying. Flux density should be maintained using ‘’505’’ solvent
NP 215F Rosin - Containing Clear amber 0.825 12% Flux has excellent foaming properties and can be applied on printed circuit boards by foam, brushing or spraying. Flux density should be maintained using ‘’510’’ solvent.
NP 302 - series No Clean Colourless 0.82 2 - 3% Surface mount devices and high density plated through hole assembly soldering for electronics and telecommunication applications. Flux density should be maintained using ‘’505’’ solvent.
NP 306 Rosin – containing No - Clean Pale yellow 0.801 4% Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using ‘’505’’ solvent.
NP 408N Rosin - Free Colourless 0.87 - 0.91 7% Suitable for plating Nickel, Silver and Copper surfaces.
NP 800 - series Rosin – Containing No Clean Halide Freen Pale yellow 0.797 – 0.802 4 – 5% Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using ‘’505’’ solvent.
NP 820 Rosin – Containing No Clean Halide Freen Pale yellow 0.797 – 0.802 4 – 5% Wave soldering, leaves a low level of non-tacky, non-corrosive residue. Flux density should be maintained using ‘’505’’ solvent.
VOC Free
NP 900 Rosin free, Water based, No- clean Colourless 1.00 2.5% Flux can be applied on printed circuit boards by foam, brushing or spraying.
Hot Air Levelling
NP – Hot Air levelling Flux - Light pink 1.13 - The flux can be applied on pre-cleaned PCBs by dip, roller-coating to brush.The flux has good thermal stability for use at solder bath temperature up to 260°C. After solder coating the flux residues are completely soluble in water; thus providing PCB,s with high ionic cleanliness
Tinning Flux
NP – Tinning Flux Water based Colourless 1.05 15–20 % The flux can be applied on pre-cleaned PCBs by dip, roller-coating to brush.
Aluminium Flux
NP – Aluminium flux - Amber to brown 1.35 - Suitable for soldering of aluminium to aluminium, aluminium to copper, aluminium to brass and aluminium to plated terminals. NP-Aluminium Flux can be used with all conventional soldering techniques.