Lead Free Solder Paste

Product Designation NP 111 NP 112
Alloy Composition Sn99.0Ag0.3Cu0.7 Sn96.5Ag3.0Cu0.5
 

 

Application

High reliability Lead Free No Clean Solder Paste:

1.Uniform and brilliant joint formation – no solder debris and low void content.

2. It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.

 

Metal %, by weight 88.5 +0.2% 88.5 + 0.2 %
Powder size Type #4 Type #4
Activity level R0L0 R0L0
Halide content Halide free Halide free
Copper Plate Corrosion Test Pass Pass
Solder Ball Pass Pass
Flux classification No – clean No – clean