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 Lead Free Solders

NP make Lead free Solders have compliance with all the requirements of RoHS directives. It has higher mechanical strength, higher yield, higher reliability and excellent wetting.

Wave and Dip lead free solders are available in a choice of lead-free variants, 99.3Sn/0.7Cu, 96.5Sn/3.5Ag and 96.5Sn/3.0Ag/0.5Cu. Other alloys are available upon request.

NP Lead-free solder is suitable for use in any wave soldering process. When converting from 63Sn/37Pb or other lead-bearing alloy, the solder pot should first be filled with pure tin. The pure tin pot should be pumped in the system for several hours to ensure that all lead from 63Sn/37Pb alloy is removed. This pure Sn should then be dumped and the pot can then be changed with lead-free solder alloy.

NP core solders are also available with Sn/Cu eutectic and Sn/Ag/Cu. Normal hand soldering procedures and iron tip temperatures (650-750°F) can be used.

The properties of few of the popular grades of Solders are tabulated below. We can also develop and manufacture Solder Sticks and Wire as per specific requirements and specifications of the Customer.
SOLDER STICKS & WIRE LEAD FREE
Alloy Composition Liquidus Temp Deg C
Form
Sticks Flux Cored Wire
Recommended Application
Sn99.3Cu0.7 227
* *
High temperature eutectic solder, provides reliable joints.
Sn99.7Ag0.3 227
* *
-
Sn96.5Ag3Cu0.5 215 - 218
* *
Most common lead free solder. Used in wave soldering for SMT components.
Sn99Ag0.3Cu0.7 217 - 228
* *
For wave soldering, Dip soldering and HAL.
Sn95Sb5 235 - 240
- *
-
Sn80Zn20 198 - 270
- **
Prevents solder ball formation and provides stable viscosity.
TIN ANODES
Sn100 231 Rectangular Anode is a positive electrode in a plating tank which conducts current into the electrolyte.
Please Note :
* Denotes manufactured and supplied.
**Denotes solid wire form i.e. without flux core. Manufactured and supplied.
The flux cored wire is available in varying flux ranging between 1.1, 2.2 and 3.5%(weight) with Resin, Rosin and Urea added with activators and other chemicals to suit the specific application requirement.
The solder wire of No-Clean classifications are manufactured in different alloy composition.
The above products are also available in solid wire form** i.e without flux core.