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 SMT SOLDER PASTE
SOLDER PASTE
Product Designation NP 109
NP 110
Alloy Composition 63Sn37Pb 62Sn36Pb2Ag
Metal %, by weight 89.5% 88 91 %
Powder size Type #3 Type #3
Activity level R0L0 R0L0
Halide content Halide free Halide free
Copper Mirror Corrosion Test Pass Pass
Solder Ball Pass Pass
Flux classification No - clean No - clean
Application :
High reliability no clean solder paste:
1. With a long stencil life and excellent solderability. NP 109 is suitable for applications that require high process tolerance during printing and reflow due to varying board types and conditions.
2. It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.