Solder Paste

SOLDER PASTE
PRODUCT DESIGNATION NP 109 NP 110
Alloy Composition 63Sn37Pb 62Sn36Pb2Ag
Metal %, by weight 89.5% 88 – 91 %
Powder size Type #3 Type #3
Activity level R0L0 R0L0
Halide content Halide free Halide free
Copper Mirror Corrosion Test Pass Pass
Solder Ball Pass Pass
Flux classification No – clean No – clean
Application :
  • High-reliability no-clean solder paste:
  • With a long stencil life and excellent solderability. NP 109 is suitable for applications that require high process tolerance during printing and reflow due to varying board types and conditions.
  • It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.