Solder Paste

Precision That Bonds. Performance That Lasts.

NP Solders’ Lead-Free Solder Paste is engineered for high-reliability electronic assemblies across automotive, telecom, consumer electronics, and industrial PCB manufacturing.

Designed for consistent printability, superior wetting, and durable joint integrity, our solder paste ensures strong metallurgical bonds while meeting global environmental standards.

✔ RoHS Compliant
✔ Halogen-Free Options Available
✔ No-Clean Formulations
✔ High Thermal Stability
✔ Excellent Print Consistency

Whether you operate high-speed SMT lines or manual repair stations, NP Solder Paste delivers predictable performance batch after batch.

NP 111 SOLDER PASTE
FLUX TYPE No-Clean
ALLOY MESH SIZE Type 3, Type 4
METAL CONTENT 88.5±0.2(%)
SDS
SOLDER ALLOY Sn99Ag0.3Cu0.7
SOLDER PASTE PRODUCT NUMBERS NP 111 SOLDER PASTE
SPEC. SHEET On Request
NP 112 SOLDER PASTE
FLUX TYPE No-Clean
ALLOY MESH SIZE Type 4
METAL CONTENT 88.5±0.2(%)
SDS
SOLDER ALLOY Sn96.5Ag3.0Cu0.5
SOLDER PASTE PRODUCT NUMBERS NP 112 SOLDER PASTE
SPEC. SHEET On Request

Why Choose NP Solder Paste?

Engineered for Modern Electronics

Modern PCBs demand tighter pitch components, higher density layouts, and flawless joint reliability. NP solder paste is formulated to support:

  • Fine-pitch stencil printing
  • Minimal solder balling
  • Controlled slump characteristics
  • Uniform reflow behavior
  • Strong shear strength

Our paste is compatible with automated stencil printing systems and reflow profiles used in high-volume manufacturing.

Applications

Trusted Across Industries

NP Solder Paste is widely used in:

  • PCB Assembly (SMT & Through-Hole Hybrid)
  • Automotive Electronics
  • Consumer Electronics
  • LED Manufacturing
  • Telecom Equipment
  • Power Supply Units
  • Control Panels
  • Repair & Rework Stations