Description
NP Solder Paste (No-Clean) is a premium-quality surface mount soldering paste formulated for consistent printing performance, excellent wetting, and reliable solder joint formation.
Designed for modern SMT production lines, this no-clean formulation leaves minimal, non-corrosive residues that eliminate the need for post-solder cleaning under controlled processing conditions.
Engineered to deliver repeatable performance in high-speed automated assembly environments.
Key Features
No-clean, low-residue formulation
Excellent stencil printing stability
Superior wetting and spread
Strong, shiny solder joints
Minimal solder ball formation
Stable tack time for component placement
High insulation resistance after reflow
| NP 109 SOLDER PASTE | |
|---|---|
| SPEC. SHEET | On Request |
| SDS | |
| ALLOY MESH SIZE | Type 3 |
| FLUX TYPE | No-Clean |
| METAL CONTENT | 89.5±0.5(%) |
| SOLDER ALLOY | 63Sn/37Pb |
| SOLDER PASTE PRODUCT NUMBERS | NP 109 SOLDER PASTE |
| NP 109 SOLDER PASTE | |
|---|---|
| SOLDER ALLOY | 63Sn/37Pb |
| METAL CONTENT | 89.5±0.5(%) |
| ALLOY MESH SIZE | Type 4 |
| SPEC. SHEET | On Request |
| FLUX TYPE | No-Clean |
| SDS | |
Why Choose NP Solders Solder Paste?
-
Uniform Solder Joint Formation
Ensures consistent and reliable connections across all joints. -
Reduced Rework and Defects
Minimizes the need for corrections, saving time and costs. -
Improved First-Pass Yield
Increases the percentage of good assemblies on the first attempt. -
Controlled Slump Behavior
Maintains solder shape and placement during the process. -
Stable Performance in Varying Humidity Conditions
Delivers reliable results even in different environmental conditions.
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