NO CLEAN

FLUXES

No-Clean Soldering Flux are low solid, formulated with small percentage of rosin and-halide free. These fluxes are applied on PCBs by wave of foam, spraying, dipping or brushing. When using the foam method of application, an air knife is recommended after operation. The air knife will ensure that flux is uniformly distributed across the board and will remove the excess flux.

Refer table below for selecting grade of flux suitable for your application.

PRODUCT DESIGNATION

TECHNOLOGY

COLOUR

       SPECIFIC       GRAVITY

   NOMINAL   SOLID CONTENT

RECOMMENDED APPLICATION
NP 302- series

No Clean

Colouriess

0.80 - 0.82
2-3%

Surface mount device and high density plated through hole assembly soldering for electronics and telecommunication application using 505 solvent.

NP 306

Rosin containg
No-Clean

Pale Yellow

0.801
4%
Wave soldering, leaves a low level of non-tacky,non-corrosive residue .Flux density should be maintained using 505 solvent 

NP Series-800

Rosin containing
No-Clean Halide Free

Pale Yellow

0.797-0.802
4-5%
Wave soldering, leaves a low level of non-tacky,non-corrosive residue .Flux density should be maintained using 505 solvent 
NP 820

Rosin containing
No-Clean Halide Free

Pale Yellow

0.797 -0.802
4 -5%
Wave soldering, leaves a low level of non-tacky,non-corrosive residue .Flux density should be maintained using 505 solvent 
VOC  FREE
NP 900
Rosin free,water based
No Clean 

Colourless

1.00
2.5%
Flux can be applied on printed circuit boards by foam, brushing or spraying.