Description
No-Clean Soldering Flux are low solid, formulated with small percentage of rosin and-halide free. These fluxes are applied on PCBs by wave of foam, spraying, dipping or brushing. When using the foam method of application, an air knife is recommended after operation. The air knife will ensure that flux is uniformly distributed across the board and will remove the excess flux.
Refer table below for selecting grade of flux suitable for your application.