Lead Free Solder Paste

LEAD FREE

SOLDER paste

      SOLDER PASTE
PRODUCT DESIGNATION

               NP 111

       NP 112

Alloy Composition

Sn99.0Ag0.3Cu0.7

Sn96.5Ag3.0Cu0.5

Metal %, by weight

88.5 +0.2%

88.5 + 0.2 %

Powder size

Type #4

Type #4

Activity level

R0L0

R0L0

Halide content

Halide free

Halide free

Copper Plate Corrosion Test

Pass

Pass

Solder Ball

Pass

Pass

Flux classification

No - clean

No - clean

Application

  • High reliability Lead Free No Clean Solder Paste:

    1.Uniform and brilliant joint formation – no solder debris and low void content.

    1. It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.