SOLDER

PASTE(Sn/Pb)

      SOLDER PASTE
PRODUCT DESIGNATION

               NP 109

       NP 110

Alloy Composition

63Sn37Pb

62Sn36Pb2Ag

Metal %, by weight

88 -91%

88 – 91 %

Powder size

Type #3, 4

Type #3, 4

Activity level

R0L0

R0L0

Halide content

Halide free

Halide free

Copper Mirror Corrosion Test

Pass

Pass

Solder Ball

Pass

Pass

Flux classification

No - clean

No - clean

Application

  • High-reliability no-clean solder paste:
  • With a long stencil life and excellent solderability, NP 109 is suitable for applications that require high process tolerance during printing and reflow due to varying board types and conditions.
  • It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.

LEAD FREE

SOLDER PASTE

      SOLDER PASTE
PRODUCT DESIGNATION

               NP 111

       NP 112

Alloy Composition

Sn99.0Ag0.3Cu0.7

Sn96.5Ag3.0Cu0.5

Metal %, by weight

88.5 +0.2%

88.5 + 0.2 %

Powder size

Type #4

Type #4

Activity level

R0L0

R0L0

Halide content

Halide free

Halide free

Copper Plate Corrosion Test

Pass

Pass

Solder Ball

Pass

Pass

Flux classification

No - clean

No - clean

Application

High reliability Lead Free No Clean Solder Paste:

1.Uniform and brilliant joint formation – no solder debris and low void content.

  1. It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.