NP is manufacturing solder paste for SMT reflow application both leaded and lead free solder paste (RoHS) most common paste used in electronics industries in leaded category is 63Sn type #3 and type #4 and in case of lead free category most common composition is 99Sn0.3Ag0.7Cu type #3 and type #4 and 96.5Sn3Ag0.5Cu in type #4.
Solder paste is crucial material in electronics manufacturing process, especially in Surface Mount Technology (SMT ) assembly it’s a mixture of finely powdered solder alloy suspended in a flux medium