SOLDER
PASTE(Sn/Pb)
SOLDER PASTE | NP 109 | NP 110 |
Alloy Composition | 63Sn37Pb | 62Sn36Pb2Ag |
Metal %, by weight | 88 - 91% | 88 – 91 % |
Powder size | Type #3, 4 | Type #3, 4 |
Activity level | R0L0 | R0L0 |
Halide content | Halide free | Halide free |
Copper Mirror Corrosion Test | Pass | Pass |
Solder Ball | Pass | Pass |
Flux classification | No - clean | No - clean |
Application
- High-reliability no-clean solder paste:
- With a long stencil life and excellent solderability, NP 109 is suitable for applications that require high process tolerance during printing and reflow due to varying board types and conditions.
- It is designed for stencil printing in a surface mount process where post reflow cleaning is not required.