Leaded Solder Paste

High-Performance SMT Soldering Solution for Precision Electronics

NP Solder Paste (No-Clean) is a premium-quality surface mount soldering paste formulated for consistent printing performance, excellent wetting, and reliable solder joint formation.

Designed for modern SMT production lines, this no-clean formulation leaves minimal, non-corrosive residues that eliminate the need for post-solder cleaning under controlled processing conditions.

Engineered to deliver repeatable performance in high-speed automated assembly environments.

Key Features

✔ No-clean, low-residue formulation
✔ Excellent stencil printing stability
✔ Superior wetting and spread
✔ Strong, shiny solder joints
✔ Minimal solder ball formation
✔ Stable tack time for component placement
✔ High insulation resistance after reflow

NP 109 SOLDER PASTE
SPEC. SHEET On Request
SDS
ALLOY MESH SIZE Type 3
FLUX TYPE No-Clean
METAL CONTENT 89.5±0.5(%)
SOLDER ALLOY 63Sn/37Pb
SOLDER PASTE PRODUCT NUMBERS NP 109 SOLDER PASTE
NP 109 SOLDER PASTE
SOLDER ALLOY 63Sn/37Pb
METAL CONTENT 89.5±0.5(%)
ALLOY MESH SIZE Type 4
SPEC. SHEET On Request
FLUX TYPE No-Clean
SDS

Why Choose NP Solders Solder Paste?

  • Uniform Solder Joint Formation
    Ensures consistent and reliable connections across all joints.

  • Reduced Rework and Defects
    Minimizes the need for corrections, saving time and costs.

  • Improved First-Pass Yield
    Increases the percentage of good assemblies on the first attempt.

  • Controlled Slump Behavior
    Maintains solder shape and placement during the process.

  • Stable Performance in Varying Humidity Conditions
    Delivers reliable results even in different environmental conditions.

Applications

  • SMT PCB Assembly

  • Reflow Soldering Processes

  • Fine-Pitch Component Soldering

  • BGA, QFN, and Micro Components

  • LED Board Assembly

  • Consumer Electronics Manufacturing

  • Automotive Electronics Production