Note: We can produce solder paste in different alloy compositions, particle sizes, and flux percentages as per customer requirements.

Product Description

High-Performance Leaded Solder Paste

Our premium 63/37 leaded solder paste is specially formulated for high-performance SMT (Surface Mount Technology) applications. Manufactured using high-purity tin-lead alloy and advanced flux technology, it provides excellent wetting, smooth solder flow, strong solder joints, and consistent printing performance for precision electronic assemblies.

Ideal for PCB assembly, electronic manufacturing, repair and rework, automotive electronics, telecommunication equipment, consumer electronics, industrial controls, and other applications where leaded solder is permitted.

Key Features

• High-purity Sn63/Pb37 eutectic alloy
• Excellent printability and stencil performance
• Superior wetting and fast solder flow
• Melting point of 183°C for reliable soldering
• Low residue after reflow soldering
• Stable viscosity for extended working life
• Consistent performance for automated production lines

Applications

• Surface Mount Technology (SMT)
• PCB Assembly
• Electronic Manufacturing
• Repair & Rework
• Consumer Electronics
• Automotive Electronics
• Telecommunication Equipment
• Industrial Electronic Assemblies

Available Paste Type

• 63/37 (Sn63/Pb37)

Packaging

• 500 Grams