NP Solder Paste (No-Clean) is a premium-quality surface mount soldering paste formulated for consistent printing performance, excellent wetting, and reliable solder joint formation.
Designed for modern SMT production lines, this no-clean formulation leaves minimal, non-corrosive residues that eliminate the need for post-solder cleaning under controlled processing conditions.
Engineered to deliver repeatable performance in high-speed automated assembly environments.
Key Features
No-clean, low-residue formulation
Excellent stencil printing stability
Superior wetting and spread
Strong, shiny solder joints
Minimal solder ball formation
Stable tack time for component placement
High insulation resistance after reflow
(63 Sn/37 Pb – Type 3/4)
| NP 109 SOLDER PASTE | |
|---|---|
| SPEC. SHEET | On Request |
| SDS | |
| ALLOY MESH SIZE | Type 3 |
| FLUX TYPE | No-Clean |
| METAL CONTENT | 89.5±0.5(%) |
| SOLDER ALLOY | 63Sn/37Pb |
| SOLDER PASTE PRODUCT NUMBERS | NP 109 SOLDER PASTE |
| NP 109 SOLDER PASTE | |
|---|---|
| SOLDER ALLOY | 63Sn/37Pb |
| METAL CONTENT | 89.5±0.5(%) |
| ALLOY MESH SIZE | Type 4 |
| SPEC. SHEET | On Request |
| FLUX TYPE | No-Clean |
| SDS | |
Why Choose NP Solders Solder Paste?
-
Uniform Solder Joint Formation
Ensures consistent and reliable connections across all joints. -
Reduced Rework and Defects
Minimizes the need for corrections, saving time and costs. -
Improved First-Pass Yield
Increases the percentage of good assemblies on the first attempt. -
Controlled Slump Behavior
Maintains solder shape and placement during the process. -
Stable Performance in Varying Humidity Conditions
Delivers reliable results even in different environmental conditions.
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