Description
NP Solders’ Lead-Free Solder Paste is engineered for high-reliability electronic assemblies across automotive, telecom, consumer electronics, and industrial PCB manufacturing.
Designed for consistent printability, superior wetting, and durable joint integrity, our solder paste ensures strong metallurgical bonds while meeting global environmental standards.
RoHS Compliant
Halogen-Free Options Available
No-Clean Formulations
High Thermal Stability
Excellent Print Consistency
Whether you operate high-speed SMT lines or manual repair stations, NP Solder Paste delivers predictable performance batch after batch.
| NP 111 SOLDER PASTE | |
|---|---|
| FLUX TYPE | No-Clean |
| ALLOY MESH SIZE | Type 3, Type 4 |
| METAL CONTENT | 88.5±0.2(%) |
| SDS | |
| SOLDER ALLOY | Sn99Ag0.3Cu0.7 |
| SOLDER PASTE PRODUCT NUMBERS | NP 111 SOLDER PASTE |
| SPEC. SHEET | On Request |
| NP 112 SOLDER PASTE | |
|---|---|
| FLUX TYPE | No-Clean |
| ALLOY MESH SIZE | Type 4 |
| METAL CONTENT | 88.5±0.2(%) |
| SDS | |
| SOLDER ALLOY | Sn96.5Ag3.0Cu0.5 |
| SOLDER PASTE PRODUCT NUMBERS | NP 112 SOLDER PASTE |
| SPEC. SHEET | On Request |
Why Choose NP Solder Paste?
Engineered for Modern Electronics
Modern PCBs demand tighter pitch components, higher density layouts, and flawless joint reliability. NP solder paste is formulated to support:
- Fine-pitch stencil printing
- Minimal solder balling
- Controlled slump characteristics
- Uniform reflow behavior
- Strong shear strength
Our paste is compatible with automated stencil printing systems and reflow profiles used in high-volume manufacturing.
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