NP Solder Paste 99.3/0.7 is a premium lead-free solder paste formulated with 99.3% Tin (Sn) and 0.7% Copper (Cu) alloy for high-reliability electronic assembly. Designed for SMT (Surface Mount Technology) applications, it offers excellent printability, superior solder wetting, and consistent reflow performance to produce strong, void-free solder joints.

Manufactured using high-purity metal powders and advanced flux technology, NP Solder Paste 99.3/0.7 provides excellent oxidation resistance, stable stencil life, and reliable electrical and mechanical performance. It is suitable for automated PCB assembly, consumer electronics, automotive electronics, telecommunications, industrial controls, and LED manufacturing.

Key Features

• Lead-free Sn99.3/Cu0.7 alloy composition
• Excellent stencil printability and tack life
• Superior solder wetting and spreading
• Low solder ball formation and minimal voiding
• Stable reflow performance with consistent results
• High insulation resistance and reliable electrical performance
• Suitable for fine-pitch SMT and BGA components
• RoHS compliant and environmentally friendly

Benefits

• Reliable Lead-Free Performance
  Delivers high-quality solder joints that meet modern lead-free manufacturing requirements.
• Excellent Print Stability
  Provides consistent stencil printing with long working life during production.
• Strong & Durable Solder Joints
  Ensures excellent mechanical strength and long-term electrical reliability.
• Reduced Manufacturing Defects
  Minimizes solder balls, bridging, and void formation to improve first-pass yield.
• Ideal for High-Volume Production
  Suitable for automated SMT assembly lines requiring consistent and repeatable performance.