NP-S007 Solder Sticks are premium lead-free solder alloys formulated for wave soldering, selective soldering, and solder pot applications. Manufactured from high-purity virgin tin and copper, they provide excellent solderability, stable alloy performance, low dross generation, and reliable solder joints for high-volume electronic manufacturing.
Designed for RoHS-compliant production, NP-S007 offers excellent thermal stability, consistent wetting characteristics, and dependable joint integrity across a wide range of PCB assembly applications.
| SOLDER STICKS – NP-S007 | |
|---|---|
| ALLOY COMPOSITION | 99.3% Tin (Sn) / 0.7% Copper (Cu) |
| ALLOY TYPE | Lead-Free Sn99.3/Cu0.7 Alloy |
| MELTING RANGE | 227°C |
| APPLICATION | Wave Soldering, Selective Soldering & Solder Pot Operations |
| WETTING PERFORMANCE | Excellent |
| DROSS FORMATION | Low |
| JOINT RELIABILITY | Excellent Mechanical Strength & Thermal Fatigue Resistance |
| COMPLIANCE | RoHS Compliant, IPC J-STD-006 |
| SPECIFICATION SHEET | Available on Request |
| SDS | Available on Request |
Note: We can manufacture solder sticks in any alloy composition according to customer requirements. Custom sizes, weights, and alloy grades are also available for specific industrial applications.
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